Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fingerprint Dive into the research topics of 'Variable frequency microwave curing of polymer materials in microelectronics packaging applications'. Together they form a unique fingerprint.

Physics & Astronomy