Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford; K. I. Sinclair; G. Goussetis; C. Bailey; M. P Y Desmulliez; A. K. Parrott; A. J. Sangster

doi:10.1109/EPTC.2007.4469757

Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system. © 2007 IEEE.

Original language	English
Title of host publication	9th Electronics Packaging Technology Conference, EPTC 2007
Pages	791-796
Number of pages	6
DOIs	https://doi.org/10.1109/EPTC.2007.4469757
Publication status	Published - 2007
Event	8th Pacific-Rim Conference on Multimedia - Hong Kong, Hong Kong Duration: 11 Dec 2007 → 14 Dec 2007

Conference

Conference	8th Pacific-Rim Conference on Multimedia
Abbreviated title	PCM 2007
Country/Territory	Hong Kong
City	Hong Kong
Period	11/12/07 → 14/12/07

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10.1109/EPTC.2007.4469757

Cite this

@inproceedings{313c71c4f30f4209a156d443a456e72f,

title = "Variable frequency microwave curing of polymer materials in microelectronics packaging applications",

abstract = "The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system. {\textcopyright} 2007 IEEE.",

author = "T. Tilford and Sinclair, \{K. I.\} and G. Goussetis and C. Bailey and Desmulliez, \{M. P Y\} and Parrott, \{A. K.\} and Sangster, \{A. J.\}",

year = "2007",

doi = "10.1109/EPTC.2007.4469757",

language = "English",

isbn = "1424413249",

pages = "791--796",

booktitle = "9th Electronics Packaging Technology Conference, EPTC 2007",

note = "8th Pacific-Rim Conference on Multimedia, PCM 2007 ; Conference date: 11-12-2007 Through 14-12-2007",

}

Tilford, T, Sinclair, KI, Goussetis, G, Bailey, C, Desmulliez, MPY, Parrott, AK & Sangster, AJ 2007, Variable frequency microwave curing of polymer materials in microelectronics packaging applications. in 9th Electronics Packaging Technology Conference, EPTC 2007. pp. 791-796, 8th Pacific-Rim Conference on Multimedia, Hong Kong, Hong Kong, 11/12/07. https://doi.org/10.1109/EPTC.2007.4469757

TY - GEN

T1 - Variable frequency microwave curing of polymer materials in microelectronics packaging applications

AU - Tilford, T.

AU - Sinclair, K. I.

AU - Goussetis, G.

AU - Bailey, C.

AU - Desmulliez, M. P Y

AU - Parrott, A. K.

AU - Sangster, A. J.

PY - 2007

Y1 - 2007

N2 - The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system. © 2007 IEEE.

AB - The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system. © 2007 IEEE.

UR - https://www.scopus.com/pages/publications/50049118320

U2 - 10.1109/EPTC.2007.4469757

DO - 10.1109/EPTC.2007.4469757

M3 - Conference contribution

SN - 1424413249

SN - 9781424413249

SP - 791

EP - 796

BT - 9th Electronics Packaging Technology Conference, EPTC 2007

T2 - 8th Pacific-Rim Conference on Multimedia

Y2 - 11 December 2007 through 14 December 2007

ER -

Variable frequency microwave curing of polymer materials in microelectronics packaging applications

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