Variable frequency microwave curing of polymer materials in microelectronics packaging applications

T. Tilford, K. I. Sinclair, G. Goussetis, C. Bailey, M. P Y Desmulliez, A. K. Parrott, A. J. Sangster

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

The use of variable frequency microwave technology in curing of polymer materials used in microelectronics applications is discussed. A revolutionary open-ended microwave curing system is outlined and assessed using experimental and numerical approaches. Experimental and numerical results are presented, demonstrating the feasibility of the system. © 2007 IEEE.

Original languageEnglish
Title of host publication9th Electronics Packaging Technology Conference, EPTC 2007
Pages791-796
Number of pages6
DOIs
Publication statusPublished - 2007
Event8th Pacific-Rim Conference on Multimedia - Hong Kong, Hong Kong
Duration: 11 Dec 200714 Dec 2007

Conference

Conference8th Pacific-Rim Conference on Multimedia
Abbreviated titlePCM 2007
CountryHong Kong
CityHong Kong
Period11/12/0714/12/07

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