UV direct-writing of metals on polyimide substrates

J. H G Ng; M. P Y Desmulliez; M. Lamponi; B. G. Moffat; A. C. Walker; A. McCarthy; H. Suyal; K. A. Prior; D. P. Hand

doi:10.1109/ESTC.2008.4684434

UV direct-writing of metals on polyimide substrates

J. H G Ng, M. P Y Desmulliez, M. Lamponi, B. G. Moffat, A. C. Walker, A. McCarthy, H. Suyal, K. A. Prior, D. P. Hand

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	691-694
Number of pages	4
DOIs	https://doi.org/10.1109/ESTC.2008.4684434
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference
Abbreviated title	ESTC
Country/Territory	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

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10.1109/ESTC.2008.4684434

Cite this

@inproceedings{1ea80c2f1c2e4a74a6f1eb2cf2facf49,

title = "UV direct-writing of metals on polyimide substrates",

abstract = "Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. {\textcopyright}2008 IEEE.",

author = "Ng, \{J. H G\} and Desmulliez, \{M. P Y\} and M. Lamponi and Moffat, \{B. G.\} and Walker, \{A. C.\} and A. McCarthy and H. Suyal and Prior, \{K. A.\} and Hand, \{D. P.\}",

year = "2008",

doi = "10.1109/ESTC.2008.4684434",

language = "English",

isbn = "9781424428144",

pages = "691--694",

booktitle = "Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC",

note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

}

Ng, JHG, Desmulliez, MPY, Lamponi, M, Moffat, BG, Walker, AC, McCarthy, A, Suyal, H, Prior, KA & Hand, DP 2008, UV direct-writing of metals on polyimide substrates. in Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. pp. 691-694, 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, United Kingdom, 1/09/08. https://doi.org/10.1109/ESTC.2008.4684434

TY - GEN

T1 - UV direct-writing of metals on polyimide substrates

AU - Ng, J. H G

AU - Desmulliez, M. P Y

AU - Lamponi, M.

AU - Moffat, B. G.

AU - Walker, A. C.

AU - McCarthy, A.

AU - Suyal, H.

AU - Prior, K. A.

AU - Hand, D. P.

PY - 2008

Y1 - 2008

N2 - Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. ©2008 IEEE.

AB - Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. ©2008 IEEE.

UR - https://www.scopus.com/pages/publications/58149102469

U2 - 10.1109/ESTC.2008.4684434

DO - 10.1109/ESTC.2008.4684434

M3 - Conference contribution

SN - 9781424428144

SP - 691

EP - 694

BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

T2 - 2008 2nd Electronics Systemintegration Technology Conference

Y2 - 1 September 2008 through 4 September 2008

ER -

UV direct-writing of metals on polyimide substrates

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