Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. ©2008 IEEE.
|Title of host publication||Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC|
|Number of pages||4|
|Publication status||Published - 2008|
|Event||2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom|
Duration: 1 Sep 2008 → 4 Sep 2008
|Conference||2008 2nd Electronics Systemintegration Technology Conference|
|Period||1/09/08 → 4/09/08|