UV direct-writing of metals on polyimide substrates

J. H G Ng, M. P Y Desmulliez, M. Lamponi, B. G. Moffat, A. C. Walker, A. McCarthy, H. Suyal, K. A. Prior, D. P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)


Copper micro-patterns have been fabricated on polyimide substrates without the use of evaporation techniques or photoresist materials. A novel easy light-directed metal patterning method has been achieved by using a photoreactive polymer reducing agent, methoxy poly(ethylene glycol) (MPEG) as a thin film coating,. The interaction of UV light and MPEG in ethanol film enables the photoreduction of mobile silver ions previously incorporated within the surface-modified polyimide substrates. The silver nanoparticle patterns thus formed serve as a active catalytic seed layer for subsequent electroless copper plating. Narrow copper tracks with low resistivity close to that of bulk copper have been achieved. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Number of pages4
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sept 20084 Sept 2008


Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
Country/TerritoryUnited Kingdom


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