UV direct-writing of metals on polyimide

J. H G Ng, M. P Y Desmulliez, Aongus McCarthy, Himanshu Suyal, Kevin A. Prior, Duncan P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Conductive micro-patterned copper tracks were fabricated by UV direct-writing of a nanoparticle silver seed layer followed by selective electroless copper deposition. Silver ions were first incorporated into a hydrolyzed polyimide surface layer by wet chemical treatment. A photoreactive polymer coating, methoxy poly(ethylene glycol) (MPEG) was coated on top of the substrate prior to UV irradiation. Electrons released through the interaction between the MPEG molecules and UV photons allowed the reduction of the silver ions across the MPEG/doped polyimide interface. The resultant silver seed layer has a cluster morphology which is suitable for the initiation of electroless plating. Initial results showed that the deposited copper tracks were in good agreement with the track width on the photomask and laser direct-writing can also fabricate smaller line width metal tracks with good accuracy. The facile fabrication presented here can be carried out in air, at atmospheric pressure, and on contoured surfaces. ©EDA Publishing/DTIP 2008.

Original languageEnglish
Title of host publicationDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Pages360-363
Number of pages4
DOIs
Publication statusPublished - 2008
EventDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Nice, France
Duration: 9 Apr 200811 Apr 2008

Conference

ConferenceDTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Country/TerritoryFrance
CityNice
Period9/04/0811/04/08

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