Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

S Stoyanov, C Bailey, Robert Kay, Marc Phillipe Yves Desmulliez, M Hendriksen

Research output: Contribution to conference › Paper

Original language	English
Publication status	Published - Dec 2003
Event	5th Electronics Packaging Technology Conference - , Singapore Duration: 1 Jan 2003 → …

Conference	5th Electronics Packaging Technology Conference
Abbreviated title	EPTC 2003
Country/Territory	Singapore
Period	1/01/03 → …

Cite this

@conference{9929bfa01f934d75a15d78aff63c404e,

title = "Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives",

author = "S Stoyanov and C Bailey and Robert Kay and Desmulliez, \{Marc Phillipe Yves\} and M Hendriksen",

year = "2003",

month = dec,

language = "English",

note = "5th Electronics Packaging Technology Conference, EPTC 2003 ; Conference date: 01-01-2003",

}