Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

S Stoyanov, C Bailey, Robert Kay, Marc Phillipe Yves Desmulliez, M Hendriksen

Research output: Contribution to conferencePaper

2 Citations (Scopus)
Original languageEnglish
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

Cite this

Stoyanov, S., Bailey, C., Kay, R., Desmulliez, M. P. Y., & Hendriksen, M. (2003). Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.