Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

E. Ramsay; K. A. Serrels; M. J. Thomson; A. J. Waddie; R. J. Warburton; M. R. Taghizadeh; D. T. Reid

Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

E. Ramsay
, K. A. Serrels
, M. J. Thomson
, A. J. Waddie
, R. J. Warburton
, M. R. Taghizadeh
, D. T. Reid

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright © 2007 ASM International® All rights reserved.

Original language	English
Title of host publication	ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis
Pages	77-80
Number of pages	4
Publication status	Published - 2007
Event	33rd International Symposium for Testing and Failure Analysis - San Jose, CA, United States Duration: 4 Nov 2007 → 8 Nov 2007

Conference

Conference	33rd International Symposium for Testing and Failure Analysis
Abbreviated title	ISTFA 2007
Country/Territory	United States
City	San Jose, CA
Period	4/11/07 → 8/11/07

Cite this

@inproceedings{89bef395afa34d839b0a38719580b9b2,

title = "Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method",

abstract = "By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright {\textcopyright} 2007 ASM International{\textregistered} All rights reserved.",

author = "E. Ramsay and Serrels, \{K. A.\} and Thomson, \{M. J.\} and Waddie, \{A. J.\} and Warburton, \{R. J.\} and Taghizadeh, \{M. R.\} and Reid, \{D. T.\}",

note = "EP/C509765/1; 33rd International Symposium for Testing and Failure Analysis, ISTFA 2007 ; Conference date: 04-11-2007 Through 08-11-2007",

year = "2007",

language = "English",

isbn = "0871708639",

pages = "77--80",

booktitle = "ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis",

}

Ramsay, E, Serrels, KA, Thomson, MJ, Waddie, AJ, Warburton, RJ, Taghizadeh, MR & Reid, DT 2007, Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method. in ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis. pp. 77-80, 33rd International Symposium for Testing and Failure Analysis, San Jose, CA, United States, 4/11/07.

Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method. / Ramsay, E.; Serrels, K. A.; Thomson, M. J. et al.
ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis. 2007. p. 77-80.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

AU - Ramsay, E.

AU - Serrels, K. A.

AU - Thomson, M. J.

AU - Waddie, A. J.

AU - Warburton, R. J.

AU - Taghizadeh, M. R.

AU - Reid, D. T.

N1 - EP/C509765/1

PY - 2007

Y1 - 2007

N2 - By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright © 2007 ASM International® All rights reserved.

AB - By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright © 2007 ASM International® All rights reserved.

UR - https://www.scopus.com/pages/publications/49649119020

M3 - Conference contribution

SN - 0871708639

SN - 9780871708632

SP - 77

EP - 80

BT - ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis

T2 - 33rd International Symposium for Testing and Failure Analysis

Y2 - 4 November 2007 through 8 November 2007

ER -

Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

Abstract

Conference

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