Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

Engineering

• Subsurface 66%
• Performance 66%
• Analytics 33%
• Experimental Result 33%
• Two Dimensional 33%
• Cross Sections 33%
• Photons 33%
• Numerical Aperture 33%
• Lateral Resolution 33%
• Images 33%
• Accuracy 33%
• Point Spread Function 33%

Physics

• Silicon 100%
• Performance 66%
• Photons 33%
• Numerical Aperture 33%
• Tungsten 33%
• Ray Tracing 33%
• Calculation 33%
• Images 33%
• Matrix 33%