Abstract
By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright © 2007 ASM International® All rights reserved.
Original language | English |
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Title of host publication | ISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis |
Pages | 77-80 |
Number of pages | 4 |
Publication status | Published - 2007 |
Event | 33rd International Symposium for Testing and Failure Analysis - San Jose, CA, United States Duration: 4 Nov 2007 → 8 Nov 2007 |
Conference
Conference | 33rd International Symposium for Testing and Failure Analysis |
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Abbreviated title | ISTFA 2007 |
Country/Territory | United States |
City | San Jose, CA |
Period | 4/11/07 → 8/11/07 |