Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method

E. Ramsay, K. A. Serrels, M. J. Thomson, A. J. Waddie, R. J. Warburton, M. R. Taghizadeh, D. T. Reid

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

By implementing two-photon optical-beam-induced-current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height. Copyright © 2007 ASM International® All rights reserved.

Original languageEnglish
Title of host publicationISTFA 2007 - Proceedings of the 33rd International Symposium for Testing and Failure Analysis
Pages77-80
Number of pages4
Publication statusPublished - 2007
Event33rd International Symposium for Testing and Failure Analysis - San Jose, CA, United States
Duration: 4 Nov 20078 Nov 2007

Conference

Conference33rd International Symposium for Testing and Failure Analysis
Abbreviated titleISTFA 2007
Country/TerritoryUnited States
CitySan Jose, CA
Period4/11/078/11/07

Fingerprint

Dive into the research topics of 'Three-dimensional nanometric sub-surface imaging of a silicon flip-chip using the two-photon optical beam induced current method'. Together they form a unique fingerprint.

Cite this