Thickness measurement and surface profiling using principles of wavefront sensing

David M. Faichnie, Ian Bain, Alan H. Greenaway

Research output: Contribution to journalArticlepeer-review


This paper will present some of the recent work undertaken to extend the use of the wavefront sensor to provide both surface profile measurements and thickness measurements simultaneously using a single instrument. Some theoretical studies of the effect of thin film structures on wavefront shape will be presented along with discussion on how such knowledge can be used to gain reliable measurements of thickness and surface profile. Our experimental methods will be described with the inclusion of experimental results from a number of different sample thicknesses and materials. In addition, some initial data will be presented to illustrate how the technique can be extended to carry out surface profiling measurements on some etched and periodic structures. Finally some suggestions for future work and optimisation will be made to conclude.

Original languageEnglish
Article number60180T
JournalProceedings of SPIE - the International Society for Optical Engineering
Publication statusPublished - 2005
Event5th International Workshop on Adaptive Optics for Industry and Medicine - Beijing, China
Duration: 29 Aug 20051 Sept 2005


  • Non-contact Metrology
  • Optical Metrology
  • Surface profiling
  • Surface shape
  • Thickness measurement


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