Thermal stress analysis of solder joints in PBGA structures subjected to power cycling

W H Muller, H J Albrecht, T Hauck, K P Herrmann

Research output: Contribution to conferencePaper

Original languageEnglish
Pages1151-1156
Number of pages6
Publication statusPublished - 1997
EventProc. Micromat '97 - Berlin, Germany
Duration: 1 Apr 1998 → …

Conference

ConferenceProc. Micromat '97
CountryGermany
CityBerlin
Period1/04/98 → …
OtherEds. B Michel and T Winkler

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