Thermal stress analysis of solder joints in PBGA structures subjected to power cycling

W H Muller, H J Albrecht, T Hauck, K P Herrmann

Research output: Contribution to conferencePaper

Original languageEnglish
Pages1151-1156
Number of pages6
Publication statusPublished - 1997
EventProc. Micromat '97 - Berlin, Germany
Duration: 1 Apr 1998 → …

Conference

ConferenceProc. Micromat '97
CountryGermany
CityBerlin
Period1/04/98 → …
OtherEds. B Michel and T Winkler

Cite this

Muller, W. H., Albrecht, H. J., Hauck, T., & Herrmann, K. P. (1997). Thermal stress analysis of solder joints in PBGA structures subjected to power cycling. 1151-1156. Paper presented at Proc. Micromat '97, Berlin, Germany.
Muller, W H ; Albrecht, H J ; Hauck, T ; Herrmann, K P. / Thermal stress analysis of solder joints in PBGA structures subjected to power cycling. Paper presented at Proc. Micromat '97, Berlin, Germany.6 p.
@conference{6ddffe88ddaf44738bfdee480f2ed569,
title = "Thermal stress analysis of solder joints in PBGA structures subjected to power cycling",
author = "Muller, {W H} and Albrecht, {H J} and T Hauck and Herrmann, {K P}",
year = "1997",
language = "English",
pages = "1151--1156",
note = "Proc. Micromat '97 ; Conference date: 01-04-1998",

}

Muller, WH, Albrecht, HJ, Hauck, T & Herrmann, KP 1997, 'Thermal stress analysis of solder joints in PBGA structures subjected to power cycling' Paper presented at Proc. Micromat '97, Berlin, Germany, 1/04/98, pp. 1151-1156.

Thermal stress analysis of solder joints in PBGA structures subjected to power cycling. / Muller, W H; Albrecht, H J; Hauck, T; Herrmann, K P.

1997. 1151-1156 Paper presented at Proc. Micromat '97, Berlin, Germany.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Thermal stress analysis of solder joints in PBGA structures subjected to power cycling

AU - Muller, W H

AU - Albrecht, H J

AU - Hauck, T

AU - Herrmann, K P

PY - 1997

Y1 - 1997

M3 - Paper

SP - 1151

EP - 1156

ER -

Muller WH, Albrecht HJ, Hauck T, Herrmann KP. Thermal stress analysis of solder joints in PBGA structures subjected to power cycling. 1997. Paper presented at Proc. Micromat '97, Berlin, Germany.