Abstract
Thermal stability of high-frequency insulated gate bipolar transistor (IGBT) operation is studied in this paper. The nonpunch-through IGBT is found to be stable when operated within its rated temperature. Thermal runaway occurs with punch-through IGBT's at temperatures below the maximum junction temperature when operated at high frequency at well below rated current, with snubber or soft-switching circuits.
Original language | English |
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Pages (from-to) | 9-16 |
Number of pages | 8 |
Journal | IEEE Transactions on Industrial Electronics |
Volume | 47 |
Issue number | 1 |
DOIs | |
Publication status | Published - Feb 2000 |