Fingerprint
Dive into the research topics of 'Thermal analysis on parchments I: DSC and TGA combined approach for heat damage assessment'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Thermal analysis on parchments I: DSC and TGA combined approach for heat damage assessment
Dimitrios Fessas, M Signorelli, Alberto Schiraldi, Craig J Kennedy, Timothy J Wess, Barbara Hassel, Kurt Nielsen
Research output: Contribution to journal › Article › peer-review
28
Citations
(Scopus)