The integration of EWOD and SAW technologies for improved droplet manipulation and mixing

Y. Li, B. W. Flynn, W. Parkes, Y. Liu, Y. Feng, A. D. Ruthven, J. G. Terry, L. I. Haworth, A. Bunting, J. T M Stevenson, S Smith, P. Bobbili, Y. Q. Fu, A. J. Walton

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper details the first reported integration of two advanced digital microfluidic technologies where 100 µm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated. ©2009 IEEE.

Original languageEnglish
Title of host publicationESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference
Pages371-374
Number of pages4
DOIs
Publication statusPublished - 2009
Event39th European Solid-State Device Research Conference - Athens, Greece
Duration: 14 Sep 200918 Sep 2009

Conference

Conference39th European Solid-State Device Research Conference
Abbreviated titleESSDERC 2009
CountryGreece
CityAthens
Period14/09/0918/09/09

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Surface waves
Acoustic waves
Digital microfluidics
Silicon
Lab-on-a-chip
Fabrication
Liquids
Substrates
Temperature

Cite this

Li, Y., Flynn, B. W., Parkes, W., Liu, Y., Feng, Y., Ruthven, A. D., ... Walton, A. J. (2009). The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. In ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference (pp. 371-374) https://doi.org/10.1109/ESSDERC.2009.5331396
Li, Y. ; Flynn, B. W. ; Parkes, W. ; Liu, Y. ; Feng, Y. ; Ruthven, A. D. ; Terry, J. G. ; Haworth, L. I. ; Bunting, A. ; Stevenson, J. T M ; Smith, S ; Bobbili, P. ; Fu, Y. Q. ; Walton, A. J. / The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference. 2009. pp. 371-374
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title = "The integration of EWOD and SAW technologies for improved droplet manipulation and mixing",
abstract = "This paper details the first reported integration of two advanced digital microfluidic technologies where 100 µm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated. {\circledC}2009 IEEE.",
author = "Y. Li and Flynn, {B. W.} and W. Parkes and Y. Liu and Y. Feng and Ruthven, {A. D.} and Terry, {J. G.} and Haworth, {L. I.} and A. Bunting and Stevenson, {J. T M} and S Smith and P. Bobbili and Fu, {Y. Q.} and Walton, {A. J.}",
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Li, Y, Flynn, BW, Parkes, W, Liu, Y, Feng, Y, Ruthven, AD, Terry, JG, Haworth, LI, Bunting, A, Stevenson, JTM, Smith, S, Bobbili, P, Fu, YQ & Walton, AJ 2009, The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. in ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference. pp. 371-374, 39th European Solid-State Device Research Conference, Athens, Greece, 14/09/09. https://doi.org/10.1109/ESSDERC.2009.5331396

The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. / Li, Y.; Flynn, B. W.; Parkes, W.; Liu, Y.; Feng, Y.; Ruthven, A. D.; Terry, J. G.; Haworth, L. I.; Bunting, A.; Stevenson, J. T M; Smith, S; Bobbili, P.; Fu, Y. Q.; Walton, A. J.

ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference. 2009. p. 371-374.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AU - Li, Y.

AU - Flynn, B. W.

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AU - Liu, Y.

AU - Feng, Y.

AU - Ruthven, A. D.

AU - Terry, J. G.

AU - Haworth, L. I.

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AU - Stevenson, J. T M

AU - Smith, S

AU - Bobbili, P.

AU - Fu, Y. Q.

AU - Walton, A. J.

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AB - This paper details the first reported integration of two advanced digital microfluidic technologies where 100 µm silicon cubes are transported with ElectroWetting On Dielectric (EWOD) and the droplet then held with EWOD while the silicon cubes are mixed with another liquid using a Surface Acoustic Wave (SAW). Together these two technologies provide a comprehensive lab-on-a-chip combination with well developed functionalities. These include droplet generation, splitting and transportation offered by EWOD with transportation, mixing and biosensing being potentially available with SAW. The fabrication of both EWOD and SAW structures on LiNb03 substrates used low temperature Ta/Ta2O5/CYTOP layer deposition and patterning technologies, which enabled efficient transportation and mixing functions to be demonstrated. ©2009 IEEE.

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Li Y, Flynn BW, Parkes W, Liu Y, Feng Y, Ruthven AD et al. The integration of EWOD and SAW technologies for improved droplet manipulation and mixing. In ESSDERC 2009 - Proceedings of the 39th European Solid-State Device Research Conference. 2009. p. 371-374 https://doi.org/10.1109/ESSDERC.2009.5331396