Test structures for the wafer mapping and correlation of the properties of electroplated ferromagnetic alloy films

Evgeny Sirotkin, Stewart Smith, Ross Walker, Jonathan G. Terry, Anthony J. Walton

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This paper presents a method of electrically determining the permeability of patterned, electroplated ferromagnetic alloys and brings together the simultaneous wafer mapping of relative permeability, electrical resistivity, and mechanical strain of these electrodeposited films, as well as the layer thickness and alloy composition. The wafer mapping of all these properties is implemented using a set of simple, automated electrical and optical techniques that facilitate the quantification of the spatial correlation between different parameters. This enables the uniformity of conductive ferromagnetic films to be analysed and supports the optimization of the physical properties of these materials as well as the processes used to deposit them.

Original languageEnglish
Pages (from-to)201-208
Number of pages8
JournalIEEE Transactions on Semiconductor Manufacturing
Volume29
Issue number3
Early online date21 Jun 2016
DOIs
Publication statusPublished - Aug 2016

Keywords

  • automated test development
  • characterisation
  • electroplated ferro-magnetic films
  • integrated magnetic technologies
  • Wafer mapping

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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