Techniques for wirebond free interconnection of piezoelectric ultrasound arrays operating above 50 MHz

INIS

• mhz range 100%
• piezoelectricity 100%
• bonding 100%
• silicon 66%
• pitches 66%
• applications 33%
• size 33%
• anisotropy 33%
• films 33%
• increasing 33%
• fabrication 33%
• powders 33%
• laser beam machining 33%
• wires 33%
• fans 33%
• blasting 33%
• fillers 33%
• ophthalmology 33%

Engineering

• Piezoelectric 100%
• Interconnects 100%
• Medical Applications 50%
• Fabrication Technique 50%
• Anisotropic Conductive Film 50%
• Piezoelectric Element 50%
• Bonding Wire 50%
• Bonding Process 50%
• Filler Material 50%
• Silicon Wafer 50%

Material Science

• Piezoelectricity 100%
• Silicon Wafer 50%
• Laser Beam Machining 50%
• Powder 50%
• Silicon 50%
• Conductive Film 50%