Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau*, S. McKay, D. Hutson, C. E. M. Demore, L. Garcia-Gancedo, T. W. Batton, J. J. McAneny, C. Cochran

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)


A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

Original languageEnglish
Title of host publication2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6
Place of PublicationNew York
Number of pages4
ISBN (Print)978-1-4244-1383-6
Publication statusPublished - 2007
EventIEEE Ultrasonics Symposium - New York
Duration: 28 Oct 200731 Oct 2007

Publication series

ISSN (Print)1051-0117


ConferenceIEEE Ultrasonics Symposium
CityNew York


  • 1-3 piezocomposite
  • high frequency array
  • lapping
  • polishing
  • microfabrication
  • photolithography


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