Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau; S. McKay; D. Hutson; C. E. M. Demore; L. Garcia-Gancedo; T. W. Batton; J. J. McAneny; C. Cochran

doi:10.1109/ULTSYM.2007.37

Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

A. L. Bernassau^*, S. McKay, D. Hutson, C. E. M. Demore, L. Garcia-Gancedo, T. W. Batton, J. J. McAneny, C. Cochran

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

Original language	English
Title of host publication	2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6
Place of Publication	New York
Publisher	IEEE
Pages	96-99
Number of pages	4
ISBN (Print)	978-1-4244-1383-6
DOIs	https://doi.org/10.1109/ULTSYM.2007.37
Publication status	Published - 2007
Event	IEEE Ultrasonics Symposium - New York Duration: 28 Oct 2007 → 31 Oct 2007

Publication series

Name	ULTRASONICS SYMPOSIUM
Publisher	IEEE
ISSN (Print)	1051-0117

Conference

Conference	IEEE Ultrasonics Symposium
City	New York
Period	28/10/07 → 31/10/07

Keywords

1-3 piezocomposite
high frequency array
lapping
polishing
microfabrication
photolithography
FABRICATION

Access to Document

10.1109/ULTSYM.2007.37

Cite this

Bernassau, A. L., McKay, S., Hutson, D., Demore, C. E. M., Garcia-Gancedo, L., Batton, T. W., McAneny, J. J., & Cochran, C. (2007). Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. In 2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6 (pp. 96-99). (ULTRASONICS SYMPOSIUM). IEEE. https://doi.org/10.1109/ULTSYM.2007.37

@inproceedings{706e3ee89afc49c38d619c97a4e10084,

title = "Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays",

abstract = "A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.",

keywords = "1-3 piezocomposite, high frequency array, lapping, polishing, microfabrication, photolithography, FABRICATION",

author = "Bernassau, {A. L.} and S. McKay and D. Hutson and Demore, {C. E. M.} and L. Garcia-Gancedo and Batton, {T. W.} and McAneny, {J. J.} and C. Cochran",

year = "2007",

doi = "10.1109/ULTSYM.2007.37",

language = "English",

isbn = "978-1-4244-1383-6",

series = "ULTRASONICS SYMPOSIUM",

publisher = "IEEE",

pages = "96--99",

booktitle = "2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6",

address = "United States",

note = "IEEE Ultrasonics Symposium ; Conference date: 28-10-2007 Through 31-10-2007",

}

Bernassau, AL, McKay, S, Hutson, D, Demore, CEM, Garcia-Gancedo, L, Batton, TW, McAneny, JJ & Cochran, C 2007, Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays. in 2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6. ULTRASONICS SYMPOSIUM, IEEE, New York, pp. 96-99, IEEE Ultrasonics Symposium, New York, 28/10/07. https://doi.org/10.1109/ULTSYM.2007.37

TY - GEN

T1 - Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

AU - Bernassau, A. L.

AU - McKay, S.

AU - Hutson, D.

AU - Demore, C. E. M.

AU - Garcia-Gancedo, L.

AU - Batton, T. W.

AU - McAneny, J. J.

AU - Cochran, C.

PY - 2007

Y1 - 2007

N2 - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

AB - A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 pm element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.

KW - 1-3 piezocomposite

KW - high frequency array

KW - lapping

KW - polishing

KW - microfabrication

KW - photolithography

KW - FABRICATION

U2 - 10.1109/ULTSYM.2007.37

DO - 10.1109/ULTSYM.2007.37

M3 - Conference contribution

SN - 978-1-4244-1383-6

T3 - ULTRASONICS SYMPOSIUM

SP - 96

EP - 99

BT - 2007 IEEE Ultrasonics Symposium Proceedings, Vols 1-6

PB - IEEE

CY - New York

T2 - IEEE Ultrasonics Symposium

Y2 - 28 October 2007 through 31 October 2007

ER -

Surface preparation of 1-3 piezocomposite material for microfabrication of high frequency transducer arrays

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