Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

G. J. Jackson, M. W. Hendriksen, R. W. Kay, M. Desmulliez, R. K. Durairaj, N. N. Ekere

Research output: Contribution to journalArticlepeer-review

26 Citations (Scopus)

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Engineering & Materials Science