New polyimide thermoset resins have been synthesized incorporating alkylenedianilines as the diamine components. The variations in intrinsic chain mobility resultant upon differences in the alkylene chain lengths produced cured resins which exhibited a wide range of Tg values (290-386°C). The structural variants of diamine within the resin formulations also effected lowering of the apparent onset temperatures for cross-linking, during cure, as the alkylene "spacer" units were extended. All resins exhibited good thermal and thermooxidative stabilities, with temperatures for 10% weight loss in the region of 450-500°C. © 1993 American Chemical Society.
|Number of pages||5|
|Publication status||Published - 1993|