Structure-property relationships in polymerization of monomeric reactant type polyimide Resins. 2. New polyimides incorporating alkylenedianilines

Barry Woodfine, Ian Soutar, Peter N. Preston, Veerappa B. Jigajinni, Nevin J. Stewart, John N. Hay

Research output: Contribution to journalArticlepeer-review

Abstract

New polyimide thermoset resins have been synthesized incorporating alkylenedianilines as the diamine components. The variations in intrinsic chain mobility resultant upon differences in the alkylene chain lengths produced cured resins which exhibited a wide range of Tg values (290-386°C). The structural variants of diamine within the resin formulations also effected lowering of the apparent onset temperatures for cross-linking, during cure, as the alkylene "spacer" units were extended. All resins exhibited good thermal and thermooxidative stabilities, with temperatures for 10% weight loss in the region of 450-500°C. © 1993 American Chemical Society.

Original languageEnglish
Pages (from-to)6330-6334
Number of pages5
JournalMacromolecules
Volume26
Issue number24
Publication statusPublished - 1993

Fingerprint Dive into the research topics of 'Structure-property relationships in polymerization of monomeric reactant type polyimide Resins. 2. New polyimides incorporating alkylenedianilines'. Together they form a unique fingerprint.

Cite this