Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component

J Jendrny, W H Muller, H J Albrecht

Research output: Contribution to conferencePaper

Original languageEnglish
Pages626-636 ??isbn
Publication statusPublished - 1997
EventProc. Surface Mount International Conference - San Jose, United States
Duration: 1 Jan 1997 → …

Conference

ConferenceProc. Surface Mount International Conference
CountryUnited States
CitySan Jose
Period1/01/97 → …

Cite this

Jendrny, J., Muller, W. H., & Albrecht, H. J. (1997). Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component. 626-636 ??isbn. Paper presented at Proc. Surface Mount International Conference, San Jose, United States.