Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component

J Jendrny, W H Muller, H J Albrecht

Research output: Contribution to conferencePaper

Original languageEnglish
Pages626-636 ??isbn
Publication statusPublished - 1997
EventProc. Surface Mount International Conference - San Jose, United States
Duration: 1 Jan 1997 → …

Conference

ConferenceProc. Surface Mount International Conference
CountryUnited States
CitySan Jose
Period1/01/97 → …

Cite this

Jendrny, J., Muller, W. H., & Albrecht, H. J. (1997). Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component. 626-636 ??isbn. Paper presented at Proc. Surface Mount International Conference, San Jose, United States.
Jendrny, J ; Muller, W H ; Albrecht, H J. / Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component. Paper presented at Proc. Surface Mount International Conference, San Jose, United States.
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Jendrny, J, Muller, WH & Albrecht, HJ 1997, 'Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component' Paper presented at Proc. Surface Mount International Conference, San Jose, United States, 1/01/97, pp. 626-636 ??isbn.

Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component. / Jendrny, J; Muller, W H; Albrecht, H J.

1997. 626-636 ??isbn Paper presented at Proc. Surface Mount International Conference, San Jose, United States.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component

AU - Jendrny, J

AU - Muller, W H

AU - Albrecht, H J

PY - 1997

Y1 - 1997

M3 - Paper

SP - 626-636 ??isbn

ER -

Jendrny J, Muller WH, Albrecht HJ. Strength and lifetime analysis of SMT solder joints: an exemplary study of the minimelf component. 1997. Paper presented at Proc. Surface Mount International Conference, San Jose, United States.