Strain-Insensitive Hierarchically Structured Stretchable Microstrip Antennas for Robust Wireless Communication

Jia Zhu, Senhao Zhang, Ning Yi, Chaoyun Song, Donghai Qiu, Zhihui Hu, Bowen Li, Chenghao Xing, Hongbo Yang, Qing Wang, Huanyu Cheng

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Abstract

As the key component of wireless data transmission and powering, stretchable antennas play an indispensable role in flexible/stretchable electronics. However, they often suffer from frequency detuning upon mechanical deformations; thus, their applications are limited to wireless sensing with wireless transmission capabilities remaining elusive. Here, a hierarchically structured stretchable microstrip antenna with meshed patterns arranged in an arched shape showcases tunable resonance frequency upon deformations with improved overall stretchability. The almost unchanged resonance frequency during deformations enables robust on-body wireless communication and RF energy harvesting, whereas the rapid changing resonance frequency with deformations allows for wireless sensing. The proposed stretchable microstrip antenna was demonstrated to communicate wirelessly with a transmitter (input power of − 3 dBm) efficiently (i.e., the receiving power higher than − 100 dBm over a distance of 100 m) on human bodies even upon 25% stretching. The flexibility in structural engineering combined with the coupled mechanical–electromagnetic simulations, provides a versatile engineering toolkit to design stretchable microstrip antennas and other potential wireless devices for stretchable electronics.[Figure not available: see fulltext.]

Original languageEnglish
Article number108
JournalNano-Micro Letters
Volume13
Issue number1
Early online date9 Apr 2021
DOIs
Publication statusE-pub ahead of print - 9 Apr 2021

Keywords

  • RF energy harvesting
  • Strain-insensitive resonance frequency
  • Stretchable microstrip antennas
  • Wearable and bio-integrated electronics
  • Wireless communication

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

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