Stencil printing at sub-100 microns pitch

M. P Y Desmulliez; R. W. Kay; S. Stoyanov; C. Bailey

Stencil printing at sub-100 microns pitch

M. P Y Desmulliez, R. W. Kay, S. Stoyanov, C. Bailey

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described. © 2004 IEEE.

Original language	English
Title of host publication	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
Pages	354-358
Number of pages	5
Publication status	Published - 2004
Event	7th Electronics Packaging Technology Conference - Singapore, Singapore Duration: 7 Dec 2005 → 9 Dec 2005

Conference

Conference	7th Electronics Packaging Technology Conference
Abbreviated title	EPTC 2005
Country/Territory	Singapore
City	Singapore
Period	7/12/05 → 9/12/05

Cite this

@inproceedings{89506581920c44018cd32ba7ce7ef027,

title = "Stencil printing at sub-100 microns pitch",

abstract = "This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described. {\textcopyright} 2004 IEEE.",

author = "Desmulliez, {M. P Y} and Kay, {R. W.} and S. Stoyanov and C. Bailey",

year = "2004",

language = "English",

isbn = "0780388216",

pages = "354--358",

booktitle = "Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004",

note = "7th Electronics Packaging Technology Conference, EPTC 2005 ; Conference date: 07-12-2005 Through 09-12-2005",

}

TY - GEN

T1 - Stencil printing at sub-100 microns pitch

AU - Desmulliez, M. P Y

AU - Kay, R. W.

AU - Stoyanov, S.

AU - Bailey, C.

PY - 2004

Y1 - 2004

N2 - This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described. © 2004 IEEE.

AB - This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described. © 2004 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=28444443427&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0780388216

SN - 9780780388215

SP - 354

EP - 358

BT - Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

T2 - 7th Electronics Packaging Technology Conference

Y2 - 7 December 2005 through 9 December 2005

ER -

Stencil printing at sub-100 microns pitch

Abstract

Conference

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