Stencil printing at sub-100 microns pitch

M. P Y Desmulliez, R. W. Kay, S. Stoyanov, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)


This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 leadfree solder pastes and conductive adhesives. The advantages of the microengineered stencil are presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described. © 2004 IEEE.

Original languageEnglish
Title of host publicationProceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
Number of pages5
Publication statusPublished - 2004
Event7th Electronics Packaging Technology Conference - Singapore, Singapore
Duration: 7 Dec 20059 Dec 2005


Conference7th Electronics Packaging Technology Conference
Abbreviated title EPTC 2005


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