Solutions to optoelectronic interconnect problems

S. Kumpatla, J. J. Casswell, J. F. Snowdon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips. © 2005 Optical Society of America.

Original languageEnglish
Title of host publication2005 OSA Topical Meeting on Information Photonics, IP 2005
Publication statusPublished - 2005
Event2005 OSA Topical Meeting on Information Photonics - Charlotte, NC, United States
Duration: 6 Jun 20058 Jun 2005

Conference

Conference2005 OSA Topical Meeting on Information Photonics
Abbreviated titleIP 2005
CountryUnited States
CityCharlotte, NC
Period6/06/058/06/05

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