Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser

C. J. Moorhouse; F. Villarreal; J. J. Wendland; H. J. Baker; D. R. Hall; D. P. Hand

doi:10.1117/12.532310

Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO₂ laser

C. J. Moorhouse, F. Villarreal, J. J. Wendland, H. J. Baker, D. R. Hall, D. P. Hand

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

CO₂ laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm^-2 for 5µm and 1500 Jcm^-2 for 12µm copper thickness, using laser pulses in the 10 µs and 20 µs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.

Original language	English
Pages (from-to)	276-283
Number of pages	8
Journal	Proceedings of SPIE - the International Society for Optical Engineering
Volume	5339
DOIs	https://doi.org/10.1117/12.532310
Publication status	Published - 2004
Event	Fiber Lasers: Technology, Systems, and Applications - San Jose, CA, United States Duration: 26 Jan 2004 → 28 Jan 2004

Keywords

Carbon dioxide lasers
Drilling
Microvia
Resin coated copper

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10.1117/12.532310

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title = "Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser",

abstract = "CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5µm and 1500 Jcm-2 for 12µm copper thickness, using laser pulses in the 10 µs and 20 µs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.",

keywords = "Carbon dioxide lasers, Drilling, Microvia, Resin coated copper",

author = "Moorhouse, {C. J.} and F. Villarreal and Wendland, {J. J.} and Baker, {H. J.} and Hall, {D. R.} and Hand, {D. P.}",

year = "2004",

doi = "10.1117/12.532310",

language = "English",

volume = "5339",

pages = "276--283",

journal = "Proceedings of SPIE - the International Society for Optical Engineering",

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note = "Fiber Lasers: Technology, Systems, and Applications ; Conference date: 26-01-2004 Through 28-01-2004",

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T1 - Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser

AU - Moorhouse, C. J.

AU - Villarreal, F.

AU - Wendland, J. J.

AU - Baker, H. J.

AU - Hall, D. R.

AU - Hand, D. P.

PY - 2004

Y1 - 2004

N2 - CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5µm and 1500 Jcm-2 for 12µm copper thickness, using laser pulses in the 10 µs and 20 µs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.

AB - CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5µm and 1500 Jcm-2 for 12µm copper thickness, using laser pulses in the 10 µs and 20 µs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.

KW - Carbon dioxide lasers

KW - Drilling

KW - Microvia

KW - Resin coated copper

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DO - 10.1117/12.532310

M3 - Article

VL - 5339

SP - 276

EP - 283

JO - Proceedings of SPIE - the International Society for Optical Engineering

JF - Proceedings of SPIE - the International Society for Optical Engineering

T2 - Fiber Lasers: Technology, Systems, and Applications

Y2 - 26 January 2004 through 28 January 2004

ER -

Single pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO₂ laser

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Keywords

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