@inproceedings{3c11d78fd6bb4a548ec9b9771a7e911e,
title = "Simulation study of cutting forces, stresses and temperature during nanometric cutting of single crystal silicon",
abstract = "Wear of diamond tool has always been a limiting factor in ductile regime machining of large size silicon components. In order to understand the tool wear phenomena, it is non-trivial to know the process outputs especially cutting forces, stresses and temperature during nanometric turning. In this paper, a realistic potential energy function has been deployed through molecular dynamic (MD) simulation, to simulate the process outputs of single diamond turning operation against single crystal silicon. The simulation result suggests that wear mechanism of diamond tool is fundamentally governed by these process parameters and thus critical.",
keywords = "WEAR, single crystal silicon, DIAMOND TOOLS, MOLECULAR-DYNAMICS SIMULATION, single point diamond turning, MD simulations",
author = "Saurav Goel and Xichun Luo and Reuben, {R. L.} and {Bin Rashid}, Walleed and Jining Sun",
year = "2012",
doi = "10.4028/www.scientific.net/KEM.496.223",
language = "English",
isbn = "978-3-03785-297-2",
series = "Key Engineering Materials",
publisher = "Trans Tech Publications",
pages = "223--228",
editor = "Morgan, {Michael N} and Andrew Shaw and Otar Mgaloblishvili",
booktitle = "Precision Machining VI",
address = "Germany",
note = "6th International Congress of Precision Machining, ICPM 2011 ; Conference date: 13-09-2011 Through 15-09-2011",
}