Selective metallisation of 3D printable thermoplastic polyurethanes

Assel Ryspayeva, Thomas D. A. Jones, Sadeque Reza Khan, Mohammadreza Nekouie Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc Phillipe Yves Desmulliez, Jose Marques-Hueso

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Abstract

This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.
Original languageEnglish
Pages (from-to)104947-104955
Number of pages9
JournalIEEE Access
Volume7
DOIs
Publication statusPublished - 29 Jul 2019

Keywords

  • direct metallisation
  • 3d printing
  • Electroplating

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