Selective metallisation of 3D printable thermoplastic polyurethanes

Assel Ryspayeva; Thomas D. A. Jones; Sadeque Khan; Mohammadreza Nekouie Esfahani; Matthew P. Shuttleworth; Russell A. Harris; Robert W. Kay; Marc Phillipe Yves Desmulliez; Jose Marques-Hueso

doi:10.1109/ACCESS.2019.2931594

Selective metallisation of 3D printable thermoplastic polyurethanes

Assel Ryspayeva, Thomas D. A. Jones, Sadeque Khan, Mohammadreza Nekouie Esfahani, Matthew P. Shuttleworth, Russell A. Harris, Robert W. Kay, Marc Phillipe Yves Desmulliez, Jose Marques-Hueso

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Abstract

This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

Original language	English
Pages (from-to)	104947-104955
Number of pages	9
Journal	IEEE Access
Volume	7
DOIs	https://doi.org/10.1109/ACCESS.2019.2931594
Publication status	Published - 29 Jul 2019

Keywords

direct metallisation
3d printing
Electroplating

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10.1109/ACCESS.2019.2931594

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title = "Selective metallisation of 3D printable thermoplastic polyurethanes",

abstract = "This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex{\textregistered}, SemiFlex{\texttrademark}, PolyFlex{\texttrademark} and NinjaFlex{\textregistered}. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex{\texttrademark} and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex{\texttrademark} material. Electroless copper deposited onto Polyflex{\texttrademark} has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex{\texttrademark} interconnects were fabricated as a proof of concept demonstrators.",

keywords = "direct metallisation, 3d printing, Electroplating",

author = "Assel Ryspayeva and Jones, {Thomas D. A.} and Sadeque Khan and Esfahani, {Mohammadreza Nekouie} and Shuttleworth, {Matthew P.} and Harris, {Russell A.} and Kay, {Robert W.} and Desmulliez, {Marc Phillipe Yves} and Jose Marques-Hueso",

year = "2019",

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TY - JOUR

T1 - Selective metallisation of 3D printable thermoplastic polyurethanes

AU - Ryspayeva, Assel

AU - Jones, Thomas D. A.

AU - Khan, Sadeque

AU - Esfahani, Mohammadreza Nekouie

AU - Shuttleworth, Matthew P.

AU - Harris, Russell A.

AU - Kay, Robert W.

AU - Desmulliez, Marc Phillipe Yves

AU - Marques-Hueso, Jose

PY - 2019/7/29

Y1 - 2019/7/29

N2 - This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

AB - This article presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex®, SemiFlex™, PolyFlex™ and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on Polyflex™ material. Electroless copper deposited onto Polyflex™ has a sheet resistance of (139.4 ± 7.2) mΩ/☐ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable to bulk copper. Copper-plated Polyflex™ interconnects were fabricated as a proof of concept demonstrators.

KW - direct metallisation

KW - 3d printing

KW - Electroplating

U2 - 10.1109/ACCESS.2019.2931594

DO - 10.1109/ACCESS.2019.2931594

M3 - Article

SN - 2169-3536

VL - 7

SP - 104947

EP - 104955

JO - IEEE Access

JF - IEEE Access

ER -

Selective metallisation of 3D printable thermoplastic polyurethanes

Abstract

Keywords

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