Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board

Nina Hendrickx, Jürgen Van Erps, Himanshu Suyal, Mohammed Taghizadeh, Hugo Thienpont, Peter Van Daele

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, laser ablation (UGent), deep proton writing (DPW) and laser direct writing (HWU) are presented as versatile technologies that can be used for the fabrication of coupling structures for optical interconnections integrated on a printed circuit board (PCB). The optical layer, a highly cross-linked acrylate based polymer, is applied on an FR4 substrate. Both laser ablation and laser direct writing are used for the definition of arrays of multimode optical waveguides, which guide the light in the plane of the optical layer. In order to couple light vertically in/out of the plane of the optical waveguides, coupling structures have to be integrated into the optical layer. Out-of-plane turning mirrors, that deflect the light beam over 90°, are used for this purpose. The surface roughness and angle of three mirror configurations are evaluated: a laser ablated one that is integrated into the optical waveguide, a laser direct written one that is also directly written onto the waveguide and a DPW insert that is plugged into a cavity into the waveguiding layer.

Original languageEnglish
Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Volume6185
DOIs
Publication statusPublished - 2006
EventOptical Sensing II - Strasbourg, France
Duration: 3 Apr 20066 Apr 2006

Conference

ConferenceOptical Sensing II
CountryFrance
CityStrasbourg
Period3/04/066/04/06

Fingerprint

printed circuits
circuit boards
roughness
optical waveguides
laser ablation
lasers
mirrors
protons
inserts
acrylates
light beams
surface roughness
waveguides
cavities
fabrication
polymers
configurations

Keywords

  • Coupling structures
  • Deep proton writing
  • Laser ablation
  • Laser direct writing
  • Optical interconnects
  • Optical waveguides
  • Surface roughness

Cite this

Hendrickx, N., Van Erps, J., Suyal, H., Taghizadeh, M., Thienpont, H., & Van Daele, P. (2006). Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration (Vol. 6185) https://doi.org/10.1117/12.665387
Hendrickx, Nina ; Van Erps, Jürgen ; Suyal, Himanshu ; Taghizadeh, Mohammed ; Thienpont, Hugo ; Van Daele, Peter. / Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. Vol. 6185 2006.
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Hendrickx, N, Van Erps, J, Suyal, H, Taghizadeh, M, Thienpont, H & Van Daele, P 2006, Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board. in Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. vol. 6185, Optical Sensing II, Strasbourg, France, 3/04/06. https://doi.org/10.1117/12.665387

Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board. / Hendrickx, Nina; Van Erps, Jürgen; Suyal, Himanshu; Taghizadeh, Mohammed; Thienpont, Hugo; Van Daele, Peter.

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. Vol. 6185 2006.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Hendrickx N, Van Erps J, Suyal H, Taghizadeh M, Thienpont H, Van Daele P. Roughness measurements on coupling structures for optical interconnections integrated on a printed circuit board. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. Vol. 6185. 2006 https://doi.org/10.1117/12.665387