Rheological characterisation and Computational Simulations of Electrically Conductive Adhesive Flows for advanced Stencil Manufacturing Technology

C Bailey; G Glinski; Marc Phillipe Yves Desmulliez; Robert Kay; N N Ekere; R Durairaj

Rheological characterisation and Computational Simulations of Electrically Conductive Adhesive Flows for advanced Stencil Manufacturing Technology

C Bailey, G Glinski, Marc Phillipe Yves Desmulliez, Robert Kay, N N Ekere, R Durairaj

School of Engineering & Physical Sciences

Research output: Contribution to conference › Paper

Original language	English
Publication status	Published - Jun 2002
Event	IMAPS conference - Cracow, Poland Duration: 1 Jan 2002 → …

Conference

Conference	IMAPS conference
Abbreviated title	IMAPS
Country/Territory	Poland
City	Cracow
Period	1/01/02 → …

Cite this

@conference{983eeb12866b4c9a832ac2de0c889329,

title = "Rheological characterisation and Computational Simulations of Electrically Conductive Adhesive Flows for advanced Stencil Manufacturing Technology",

author = "C Bailey and G Glinski and Desmulliez, \{Marc Phillipe Yves\} and Robert Kay and Ekere, \{N N\} and R Durairaj",

year = "2002",

month = jun,

language = "English",

note = "IMAPS conference, IMAPS ; Conference date: 01-01-2002",

}