Rheological characterisation and Computational Simulations of Electrically Conductive Adhesive Flows for advanced Stencil Manufacturing Technology

C Bailey, G Glinski, Marc Phillipe Yves Desmulliez, Robert Kay, N N Ekere, R Durairaj

Research output: Contribution to conferencePaper

Original languageEnglish
Publication statusPublished - Jun 2002
EventIMAPS conference - Cracow, Poland
Duration: 1 Jan 2002 → …

Conference

ConferenceIMAPS conference
Abbreviated titleIMAPS
CountryPoland
CityCracow
Period1/01/02 → …

Cite this

Bailey, C., Glinski, G., Desmulliez, M. P. Y., Kay, R., Ekere, N. N., & Durairaj, R. (2002). Rheological characterisation and Computational Simulations of Electrically Conductive Adhesive Flows for advanced Stencil Manufacturing Technology. Paper presented at IMAPS conference, Cracow, Poland.