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Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System
Raphael Adamietz, Marc Phillipe Yves Desmulliez, Sumanth Kumar Pavuluri, Tim Tilford, Chris Bailey, Thomas Schreier-Alt, Jens Warmuth
Research output: Contribution to journal › Article › peer-review
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