Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System
- Raphael Adamietz
- , Marc Phillipe Yves Desmulliez
- , Sumanth Kumar Pavuluri
- , Tim Tilford
- , Chris Bailey
- , Thomas Schreier-Alt
- , Jens Warmuth
Research output: Contribution to journal › Article › peer-review
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