Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System

Raphael Adamietz; Marc Phillipe Yves Desmulliez; Sumanth Kumar Pavuluri; Tim Tilford; Chris Bailey; Thomas Schreier-Alt; Jens Warmuth

doi:10.1109/TCPMT.2018.2859031

Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System

Raphael Adamietz, Marc Phillipe Yves Desmulliez, Sumanth Kumar Pavuluri, Tim Tilford, Chris Bailey, Thomas Schreier-Alt, Jens Warmuth

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

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Abstract

In this paper, the influence of microwave curing on the reliability of a representative electronic package is examined by reliability testing and measurement of residual stresses. A LM358 voltage regulator die was mounted to an open Quad Flat No-leads package (QFN) for reliability testing. For the stress measurement, a specifically designed stress measurement die was mounted to the QFN package. The chips were encapsulated with_Hysol EO1080 thermosetting polymer material. Curing was performed using an open-ended microwave oven system equipped with in situ temperature control. Three different temperature profiles for microwave curing were selected according to the requested degree of cure and chemical composition of the cured material. A convection cure profile was selected for the control group samples. Thermal cycling and HAST tests were performed on a total number of 80 chips. 95 QFN packages with stress measurement chips were also manufactured. Increased lifetime expectancy of the microwave cured packaged chips was experimentally demonstrated and measured between 62% to 149% increased lifetime expectancy after Temperature Cycling Test (TCT), and between 63% and 331% after highly Accelerated Ageing Test (HAST) and TCT compared to conventionally cured packages. Analysis of specifically designed stress test chips showed significantly lower residual stresses ranging from 26 MPa to 58.3 MPa within the microwave cured packages compared to conventionally cured packaged chips which displayed residual stresses ranging from 54 MPa to 80.5 MPa. This article therefore provides additional confidence in the industrial relevance of the microwave curing system and its advantages compared to traditional convection oven systems.

Original language	English
Pages (from-to)	173-180
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	9
Issue number	1
Early online date	23 Jul 2018
DOIs	https://doi.org/10.1109/TCPMT.2018.2859031
Publication status	Published - Jan 2019

Keywords

accelerated stress test
convection oven
encapsulation
microelectronics packaging
microwave curing
open-ended oven
reliability testing
residual stress

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/TCPMT.2018.2859031

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title = "Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System",

abstract = "In this paper, the influence of microwave curing on the reliability of a representative electronic package is examined by reliability testing and measurement of residual stresses. A LM358 voltage regulator die was mounted to an open Quad Flat No-leads package (QFN) for reliability testing. For the stress measurement, a specifically designed stress measurement die was mounted to the QFN package. The chips were encapsulated with_Hysol EO1080 thermosetting polymer material. Curing was performed using an open-ended microwave oven system equipped with in situ temperature control. Three different temperature profiles for microwave curing were selected according to the requested degree of cure and chemical composition of the cured material. A convection cure profile was selected for the control group samples. Thermal cycling and HAST tests were performed on a total number of 80 chips. 95 QFN packages with stress measurement chips were also manufactured. Increased lifetime expectancy of the microwave cured packaged chips was experimentally demonstrated and measured between 62% to 149% increased lifetime expectancy after Temperature Cycling Test (TCT), and between 63% and 331% after highly Accelerated Ageing Test (HAST) and TCT compared to conventionally cured packages. Analysis of specifically designed stress test chips showed significantly lower residual stresses ranging from 26 MPa to 58.3 MPa within the microwave cured packages compared to conventionally cured packaged chips which displayed residual stresses ranging from 54 MPa to 80.5 MPa. This article therefore provides additional confidence in the industrial relevance of the microwave curing system and its advantages compared to traditional convection oven systems.",

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Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System. / Adamietz, Raphael; Desmulliez, Marc Phillipe Yves; Pavuluri, Sumanth Kumar et al.
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 1, 01.2019, p. 173-180.

Research output: Contribution to journal › Article › peer-review

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Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-ended Microwave Curing System

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Keywords

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