Reduced thermal conductivity in silicon thin-films via vacancies

Neil Wight, Nick Bennett

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

An experimental method is defined that reduces the thermal conductivity in Si films by ~90% compared to control samples, while keeping the thermoelectric power factor almost unchanged. This is done by creating vacancy-rich films via high-energy self-implantation of Si, followed by rapid-thermal annealing. TCAD simulations suggest that this approach is scalable for application in thin-film thermoelectric generators, as an alternative to more expensive and less Earth-abundant materials such as bismuth telluride. This approach to Si thermoelectrics could be straight-forward for scale-up to thin-film device dimensions, something that is a major challenge for other methods used for Si thermal conductivity reduction.

Original languageEnglish
Title of host publicationGettering and Defect Engineering in Semiconductor Technology XVI
PublisherTrans Tech Publications
Pages344-349
Number of pages6
Volume242
ISBN (Print)978-3-03835-608-0
DOIs
Publication statusPublished - 2015
Event16th International Conference on Gettering and Defect Engineering in Semiconductor Technology - Bad Staffelstein, Germany
Duration: 20 Sep 201525 Sep 2015

Publication series

NameSolid State Phenomena
Volume242
ISSN (Electronic)1662-9779

Conference

Conference16th International Conference on Gettering and Defect Engineering in Semiconductor Technology
Abbreviated titleGADEST 2015
CountryGermany
CityBad Staffelstein
Period20/09/1525/09/15

Keywords

  • Silicon
  • Thermal conductivity
  • Thermoelectric
  • Thin-film
  • Vacancy

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Atomic and Molecular Physics, and Optics

Fingerprint Dive into the research topics of 'Reduced thermal conductivity in silicon thin-films via vacancies'. Together they form a unique fingerprint.

  • Cite this

    Wight, N., & Bennett, N. (2015). Reduced thermal conductivity in silicon thin-films via vacancies. In Gettering and Defect Engineering in Semiconductor Technology XVI (Vol. 242, pp. 344-349). (Solid State Phenomena; Vol. 242). Trans Tech Publications. https://doi.org/10.4028/www.scientific.net/SSP.242.344