Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

INIS

• thin films 100%
• lasers 100%
• panels 100%
• fill factors 100%
• losses 50%
• cost 50%
• performance 50%
• lifetime 50%
• equipment 50%
• power 50%
• output 50%
• testing 50%
• heat 50%
• capital 50%
• additives 50%
• packaging 50%
• encapsulation 50%
• cadmium tellurides 50%
• thermal cycling 50%

Engineering

• One Step 100%
• Inkjet Printing 100%
• Interconnects 100%
• Thin Films 100%
• Fill Factor 66%
• Equipment Cost 33%
• Electrical Performance 33%
• Capital Equipment 33%
• Additive Manufacture 33%
• Damp Heat 33%
• Power Output 33%

Material Science

• Thin Films 100%
• Thermal Cycling 50%