Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

M. L. Crozier; P. Adamson; A. Brunton; S. Henley; J. D. Shephard; G. Kartopu; S. Irvine; P. M. Kaminski; J. M. Walls

doi:10.1109/PVSC.2014.6925507

Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

M. L. Crozier, P. Adamson, A. Brunton, S. Henley, J. D. Shephard, G. Kartopu, S. Irvine, P. M. Kaminski, J. M. Walls

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

8 Citations (Scopus)

Abstract

An optimized series interconnection process can provide many benefits for the manufacture of thin-film PV including lower panel transit times, lower capital equipment costs, smaller line foot print and less panel area wasted. The One Step Interconnect (OSI) process has been previously introduced [1]. It utilizes conventional laser scribing and inkjet additive manufacture to form the series interconnect. Good electrical performance has previously been achieved on CdTe mini-modules. Here the latest developments are presented. Further mini-module electrical results are shown with Fill Factors (FFs) of, on average, 70% and up to 80%. No loss of fill factor is seen as cells are connected in series. An extensive lifetime testing program is now underway. An encapsulation process has been found and verified using the IEC 61646 standard damp heat test for packaging integrity. Over 400 hours of thermal cycling has been completed on OSI interconnected modules with no degradation in power output.

Original language	English
Title of host publication	2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014
Publisher	IEEE
Pages	2784-2788
Number of pages	5
ISBN (Print)	9781479943982
DOIs	https://doi.org/10.1109/PVSC.2014.6925507
Publication status	Published - 2014
Event	40th IEEE Photovoltaic Specialist Conference 2014 - Denver, United Kingdom Duration: 8 Jun 2014 → 13 Jun 2014

Conference

Conference	40th IEEE Photovoltaic Specialist Conference 2014
Abbreviated title	PVSC 2014
Country/Territory	United Kingdom
City	Denver
Period	8/06/14 → 13/06/14

Keywords

CdTe
CIGS
inkjet
interconnect
laser
silicon
thin film

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/PVSC.2014.6925507

Cite this

Crozier, M. L., Adamson, P., Brunton, A., Henley, S., Shephard, J. D., Kartopu, G., Irvine, S., Kaminski, P. M., & Walls, J. M. (2014). Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing. In 2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014 (pp. 2784-2788). Article 6925507 IEEE. https://doi.org/10.1109/PVSC.2014.6925507

@inproceedings{9265c4c1143e43fbbb66b862a8192d4b,

title = "Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing",

abstract = "An optimized series interconnection process can provide many benefits for the manufacture of thin-film PV including lower panel transit times, lower capital equipment costs, smaller line foot print and less panel area wasted. The One Step Interconnect (OSI) process has been previously introduced [1]. It utilizes conventional laser scribing and inkjet additive manufacture to form the series interconnect. Good electrical performance has previously been achieved on CdTe mini-modules. Here the latest developments are presented. Further mini-module electrical results are shown with Fill Factors (FFs) of, on average, 70% and up to 80%. No loss of fill factor is seen as cells are connected in series. An extensive lifetime testing program is now underway. An encapsulation process has been found and verified using the IEC 61646 standard damp heat test for packaging integrity. Over 400 hours of thermal cycling has been completed on OSI interconnected modules with no degradation in power output.",

keywords = "CdTe, CIGS, inkjet, interconnect, laser, silicon, thin film",

author = "Crozier, {M. L.} and P. Adamson and A. Brunton and S. Henley and Shephard, {J. D.} and G. Kartopu and S. Irvine and Kaminski, {P. M.} and Walls, {J. M.}",

year = "2014",

doi = "10.1109/PVSC.2014.6925507",

language = "English",

isbn = "9781479943982",

pages = "2784--2788",

booktitle = "2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014",

publisher = "IEEE",

address = "United States",

note = "40th IEEE Photovoltaic Specialist Conference 2014, PVSC 2014 ; Conference date: 08-06-2014 Through 13-06-2014",

}

Crozier, ML, Adamson, P, Brunton, A, Henley, S, Shephard, JD, Kartopu, G, Irvine, S, Kaminski, PM & Walls, JM 2014, Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing. in 2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014., 6925507, IEEE, pp. 2784-2788, 40th IEEE Photovoltaic Specialist Conference 2014, Denver, United Kingdom, 8/06/14. https://doi.org/10.1109/PVSC.2014.6925507

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AU - Crozier, M. L.

AU - Adamson, P.

AU - Brunton, A.

AU - Henley, S.

AU - Shephard, J. D.

AU - Kartopu, G.

AU - Irvine, S.

AU - Kaminski, P. M.

AU - Walls, J. M.

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AB - An optimized series interconnection process can provide many benefits for the manufacture of thin-film PV including lower panel transit times, lower capital equipment costs, smaller line foot print and less panel area wasted. The One Step Interconnect (OSI) process has been previously introduced [1]. It utilizes conventional laser scribing and inkjet additive manufacture to form the series interconnect. Good electrical performance has previously been achieved on CdTe mini-modules. Here the latest developments are presented. Further mini-module electrical results are shown with Fill Factors (FFs) of, on average, 70% and up to 80%. No loss of fill factor is seen as cells are connected in series. An extensive lifetime testing program is now underway. An encapsulation process has been found and verified using the IEC 61646 standard damp heat test for packaging integrity. Over 400 hours of thermal cycling has been completed on OSI interconnected modules with no degradation in power output.

KW - CdTe

KW - CIGS

KW - inkjet

KW - interconnect

KW - laser

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KW - thin film

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BT - 2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014

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ER -

Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

Abstract

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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