Recent developments toward a one step thin-film PV interconnection process using laser scribing and inkjet printing

M. L. Crozier, P. Adamson, A. Brunton, S. Henley, J. D. Shephard, G. Kartopu, S. Irvine, P. M. Kaminski, J. M. Walls

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)


An optimized series interconnection process can provide many benefits for the manufacture of thin-film PV including lower panel transit times, lower capital equipment costs, smaller line foot print and less panel area wasted. The One Step Interconnect (OSI) process has been previously introduced [1]. It utilizes conventional laser scribing and inkjet additive manufacture to form the series interconnect. Good electrical performance has previously been achieved on CdTe mini-modules. Here the latest developments are presented. Further mini-module electrical results are shown with Fill Factors (FFs) of, on average, 70% and up to 80%. No loss of fill factor is seen as cells are connected in series. An extensive lifetime testing program is now underway. An encapsulation process has been found and verified using the IEC 61646 standard damp heat test for packaging integrity. Over 400 hours of thermal cycling has been completed on OSI interconnected modules with no degradation in power output.

Original languageEnglish
Title of host publication2014 IEEE 40th Photovoltaic Specialist Conference, PVSC 2014
Number of pages5
ISBN (Print)9781479943982
Publication statusPublished - 2014
Event40th IEEE Photovoltaic Specialist Conference 2014 - Denver, United Kingdom
Duration: 8 Jun 201413 Jun 2014


Conference40th IEEE Photovoltaic Specialist Conference 2014
Abbreviated titlePVSC 2014
Country/TerritoryUnited Kingdom


  • CdTe
  • CIGS
  • inkjet
  • interconnect
  • laser
  • silicon
  • thin film

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials


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