Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

INIS

• layers 100%
• polymers 100%
• lasers 100%
• bonding 100%
• packaging 100%
• substrates 60%
• silicon 60%
• glass 40%
• beams 40%
• manufacturing 40%
• beam profiles 40%
• applications 20%
• surfaces 20%
• fibers 20%
• monitoring 20%
• plates 20%
• energy 20%
• thin films 20%
• power 20%
• adhesives 20%
• defects 20%
• temperature distribution 20%
• temperature monitoring 20%

Engineering

• Intermediate Layer 100%
• Microelectromechanical System 100%
• Silicon Substrate 33%
• Laser Beam 33%
• High Power Diode Laser 33%
• Plate Element 33%
• Optical Phase 33%
• Forming Method 33%
• Photonics 33%
• Illustrates 33%
• Energy Engineering 33%
• Defects 33%
• Microsensor 33%
• Process Monitoring 33%
• Beam Forming 33%
• Temperature Distribution 33%
• Thin Films 33%
• Electronic Packaging 33%

Material Science

• Microelectromechanical System 100%
• Silicon 100%
• Laser Diode 66%
• Thin Films 33%