Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

Wang Changhai, Zeng Jun, Liu Yufei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the recent advances in the development of a laser assisted fast polymer bonding method for electronic packaging applications. In this method a high power diode laser is used to cure a polymer adhesive material to bond substrates together. A unique beam forming method using custom designed optical phase plate elements was developed to transform a fiber delivered laser beam into top-hat and frame shaped beam profiles for energy efficient polymer bonding for electronics manufacturing. In addition it has been found that the frame shaped beam profile can produce a desirable temperature distribution for MEMS packaging in which the surface temperature at the center of the substrate is lower by ~50°C than the packaging temperature (~300°C) when bonding a glass cap to a silicon substrate. An accurate temperature monitoring method using an embedded thin film microsensor array has been developed and has been used successfully for process monitoring. Defect-free fast bonding (~10 seconds) of transparent cap (glass) and non-transparent cap (silicon) to a silicon chip has been demonstrated. This work illustrates the potential of the diode laser based photonic technology for advanced MEMS packaging and electronics manufacturing. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages31-35
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

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  • Cite this

    Changhai, W., Jun, Z., & Yufei, L. (2009). Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 31-35) https://doi.org/10.1109/ICEPT.2009.5270799