Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

Wang Changhai, Zeng Jun, Liu Yufei

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the recent advances in the development of a laser assisted fast polymer bonding method for electronic packaging applications. In this method a high power diode laser is used to cure a polymer adhesive material to bond substrates together. A unique beam forming method using custom designed optical phase plate elements was developed to transform a fiber delivered laser beam into top-hat and frame shaped beam profiles for energy efficient polymer bonding for electronics manufacturing. In addition it has been found that the frame shaped beam profile can produce a desirable temperature distribution for MEMS packaging in which the surface temperature at the center of the substrate is lower by ~50°C than the packaging temperature (~300°C) when bonding a glass cap to a silicon substrate. An accurate temperature monitoring method using an embedded thin film microsensor array has been developed and has been used successfully for process monitoring. Defect-free fast bonding (~10 seconds) of transparent cap (glass) and non-transparent cap (silicon) to a silicon chip has been demonstrated. This work illustrates the potential of the diode laser based photonic technology for advanced MEMS packaging and electronics manufacturing. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages31-35
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

Fingerprint

packaging
microelectromechanical systems
caps
polymers
lasers
silicon
manufacturing
semiconductor lasers
electronic packaging
glass
beamforming
profiles
electronics
adhesives
surface temperature
fiber lasers
temperature distribution
chips
laser beams
photonics

Cite this

Changhai, W., Jun, Z., & Yufei, L. (2009). Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 31-35) https://doi.org/10.1109/ICEPT.2009.5270799
Changhai, Wang ; Jun, Zeng ; Yufei, Liu. / Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. pp. 31-35
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Changhai, W, Jun, Z & Yufei, L 2009, Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. pp. 31-35, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, 10/08/09. https://doi.org/10.1109/ICEPT.2009.5270799

Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. / Changhai, Wang; Jun, Zeng; Yufei, Liu.

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 31-35.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Changhai W, Jun Z, Yufei L. Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 31-35 https://doi.org/10.1109/ICEPT.2009.5270799