Rapid single-photon 3D imaging in highly scattering underwater environments

Rui Zhang*, Germán Mora Martin, Alistair Gorman, Robert K. Henderson, Gerald S. Buller, Istvan Gyongy, Aurora Maccarone

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abstract

We demonstrated a transceiver system for underwater three-dimensional imaging, based on a 64 ×32 macro-pixel direct time-of-flight (dToF) SPAD detector array fabricated using complementary metal-oxide-semiconductor (CMOS) technology. The sensor featured integrated multi-event time-to-digital converters (METDC) per macro-pixel, and operated in a time-gated mode which allowed the improved rejection of the backscattering from the signal return. The performance of the system was assessed in a controlled underwater environment, utilizing a moving target placed in a water tank at a stand-off distance of 1.45 m in water. The system demonstrated rapid 3D imaging by using short acquisition times of 1 ms, which corresponds to a frame rate of 1000 fps. Depth and intensity profiles were obtained at attenuation levels equivalent up to 5.5 attenuation lengths between the transceiver and the target, and using average optical power of up to 32 mW.

Original languageEnglish
Title of host publicationEmerging Imaging and Sensing Technologies for Security and Defence IX
EditorsGerald S. Buller, Robert A. Lamb, Martin Laurenzis
PublisherSPIE
ISBN (Electronic)9781510681170
ISBN (Print)9781510681163
DOIs
Publication statusPublished - 15 Nov 2024
EventSecurity + Defence 2024 - Edinburgh, United Kingdom
Duration: 17 Sept 202419 Sept 2024

Publication series

NameProceedings of SPIE
Volume13204
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceSecurity + Defence 2024
Country/TerritoryUnited Kingdom
CityEdinburgh
Period17/09/2419/09/24

Keywords

  • CMOS SPAD
  • rapid imaging
  • scattering
  • single-photon
  • Underwater imaging

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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