Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

J. H G Ng, David Flynn, Yves Lacrotte, M. P Y Desmulliez, Robert Ssekitoleko, Christine Démoré, Sandy Cochran

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.

Original languageEnglish
Title of host publicationElectronics System Integration Technology Conference, ESTC 2010 - Proceedings
DOIs
Publication statusPublished - 2010
Event3rd Electronics System Integration Technology Conference - Berlin, Germany
Duration: 13 Sep 201016 Sep 2010

Conference

Conference3rd Electronics System Integration Technology Conference
Abbreviated titleESTC 2010
CountryGermany
CityBerlin
Period13/09/1016/09/10

Fingerprint

Ultrasonic transducers
Ultrasonic devices
Fabrication
Electrodes
Acoustic impedance
Networks (circuits)
Blasting
Photolithography
Signal interference
Adhesives
Packaging
Alumina
Resins
Ultrasonics
Powders
Geometry
Composite materials

Cite this

Ng, J. H. G., Flynn, D., Lacrotte, Y., Desmulliez, M. P. Y., Ssekitoleko, R., Démoré, C., & Cochran, S. (2010). Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers. In Electronics System Integration Technology Conference, ESTC 2010 - Proceedings https://doi.org/10.1109/ESTC.2010.5642978
Ng, J. H G ; Flynn, David ; Lacrotte, Yves ; Desmulliez, M. P Y ; Ssekitoleko, Robert ; Démoré, Christine ; Cochran, Sandy. / Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers. Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 2010.
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abstract = "The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.",
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Ng, JHG, Flynn, D, Lacrotte, Y, Desmulliez, MPY, Ssekitoleko, R, Démoré, C & Cochran, S 2010, Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers. in Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 3rd Electronics System Integration Technology Conference, Berlin, Germany, 13/09/10. https://doi.org/10.1109/ESTC.2010.5642978

Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers. / Ng, J. H G; Flynn, David; Lacrotte, Yves; Desmulliez, M. P Y; Ssekitoleko, Robert; Démoré, Christine; Cochran, Sandy.

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 2010.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

AU - Ng, J. H G

AU - Flynn, David

AU - Lacrotte, Yves

AU - Desmulliez, M. P Y

AU - Ssekitoleko, Robert

AU - Démoré, Christine

AU - Cochran, Sandy

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AB - The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.

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SN - 9781424485536

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ER -

Ng JHG, Flynn D, Lacrotte Y, Desmulliez MPY, Ssekitoleko R, Démoré C et al. Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers. In Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 2010 https://doi.org/10.1109/ESTC.2010.5642978