Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.
|Title of host publication||IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012|
|Number of pages||4|
|Publication status||Published - 2012|
|Event||14th Electronics Packaging Technology Conference - Singapore, Singapore, Singapore|
Duration: 5 Dec 2012 → 7 Dec 2012
|Conference||14th Electronics Packaging Technology Conference|
|Period||5/12/12 → 7/12/12|