Progress towards filling through silicon vias with conductive inks

Gerard Cummins, Jack Hoy-Gig Ng, Marc Phillipe Yves Desmulliez, Robert W Kay, A J Walton, J G Terry

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.
Original languageEnglish
Title of host publicationIEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
PublisherIEEE
Pages691-694
Number of pages4
ISBN (Electronic)978-1-4673-4551-4
ISBN (Print)978-1-4673-4553-8
DOIs
Publication statusPublished - 2012
Event14th Electronics Packaging Technology Conference - Singapore, Singapore, Singapore
Duration: 5 Dec 20127 Dec 2012

Conference

Conference14th Electronics Packaging Technology Conference
Abbreviated titleEPTC
CountrySingapore
CitySingapore
Period5/12/127/12/12

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