Progress towards filling through silicon vias with conductive inks

Gerard Cummins; Jack Hoy-Gig Ng; Marc Phillipe Yves Desmulliez; Robert W Kay; A J Walton; J G Terry

doi:10.1109/EPTC.2012.6507170

Progress towards filling through silicon vias with conductive inks

Gerard Cummins, Jack Hoy-Gig Ng, Marc Phillipe Yves Desmulliez, Robert W Kay, A J Walton, J G Terry

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

Original language	English
Title of host publication	IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012
Publisher	IEEE
Pages	691-694
Number of pages	4
ISBN (Electronic)	978-1-4673-4551-4
ISBN (Print)	978-1-4673-4553-8
DOIs	https://doi.org/10.1109/EPTC.2012.6507170
Publication status	Published - 2012
Event	14th Electronics Packaging Technology Conference - Singapore, Singapore, Singapore Duration: 5 Dec 2012 → 7 Dec 2012

Conference

Conference	14th Electronics Packaging Technology Conference
Abbreviated title	EPTC
Country/Territory	Singapore
City	Singapore
Period	5/12/12 → 7/12/12

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10.1109/EPTC.2012.6507170

Cite this

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title = "Progress towards filling through silicon vias with conductive inks",

abstract = "Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.",

author = "Gerard Cummins and Ng, {Jack Hoy-Gig} and Desmulliez, {Marc Phillipe Yves} and Kay, {Robert W} and Walton, {A J} and Terry, {J G}",

year = "2012",

doi = "10.1109/EPTC.2012.6507170",

language = "English",

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pages = "691--694",

booktitle = "IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012",

publisher = "IEEE",

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note = "14th Electronics Packaging Technology Conference, EPTC ; Conference date: 05-12-2012 Through 07-12-2012",

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TY - GEN

T1 - Progress towards filling through silicon vias with conductive inks

AU - Cummins, Gerard

AU - Ng, Jack Hoy-Gig

AU - Desmulliez, Marc Phillipe Yves

AU - Kay, Robert W

AU - Walton, A J

AU - Terry, J G

PY - 2012

Y1 - 2012

N2 - Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

AB - Inkjet printing is a promising additive manufacturing technology that is being increasingly used in applications such as displays, electronics and electronic packaging. Through Silicon Vias (TSVs) is an important enabling technology for advanced electronic packaging. The direct write nature of inkjet printing would also allow flexible packaging solutions through the cheap and sustainable filling of vias. This paper describes the progress to date with using this printing technology to fill TSVs and some of the challenges encountered to date.

U2 - 10.1109/EPTC.2012.6507170

DO - 10.1109/EPTC.2012.6507170

M3 - Conference contribution

SN - 978-1-4673-4553-8

SP - 691

EP - 694

BT - IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012

PB - IEEE

T2 - 14th Electronics Packaging Technology Conference

Y2 - 5 December 2012 through 7 December 2012

ER -

Progress towards filling through silicon vias with conductive inks

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