Polymer cure modeling for microelectronics applications

James E. Morris, Tim Tilford, Chris Bailey, Keith I. Sinclair, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Abstract

A review ofpolymer cure models used in microelectronics packaging applications reveals no clear consensus ofthe chemical rate constants for the cure reactions, or even ofan effective model. The problem lies in the contrast between the actual cure process, which involves a sequence ofdistinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on the independence of their characteristic constants.) The standard techniques to determine the model parameters are based on differential scanning calorimetry (DSC), which cannot distinguish between the reactions, and hence yields results useful only under the same conditions, which completely misses the point of modeling. The obvious solution is for manufacturers to provide the modeling parameters, but failing that, an alternative experimental technique is required to determine individual reaction parameters, e.g. Fourier transform infra-red spectroscopy (FTIR).

Original languageEnglish
Title of host publicationISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings
DOIs
Publication statusPublished - 2009
EventISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Brno, Czech Republic
Duration: 13 May 200917 May 2009

Conference

ConferenceISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics
CountryCzech Republic
CityBrno
Period13/05/0917/05/09

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  • Cite this

    Morris, J. E., Tilford, T., Bailey, C., Sinclair, K. I., & Desmulliez, M. P. Y. (2009). Polymer cure modeling for microelectronics applications. In ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings https://doi.org/10.1109/ISSE.2009.5206929