Polyimide microcantilever surface stress sensor using low-cost, rapidly-interchangeable, spring-loaded microprobe connections

R. H. Ibbotson, R. J. Dunn, V. Djakov, P. K. Ferrigno, S. E. Huq

Research output: Contribution to journalArticle

12 Citations (Scopus)

Abstract

We present the fabrication of a polyimide microcantilever array with integrated gold piezoresistive strain gauges and a thick SU-8 backing for use as a surface stress sensor. The selected polyimide's low Young's modulus (1.8 GPa) theoretically results in a high sensitivity to changes in surface stress. Electroplated gold contact pads, 1.5 µm thick, provide a stable, repeatable surface onto which electrical connections to the fabricated device are made using spring-loaded microprobes. The piezoresistors are found to have a gauge factor of between 4 and 4.5 and a sensitivity to surface stress of 2.1 × 10-4 (N/m)-1. © 2008 Elsevier B.V. All rights reserved.

Original languageEnglish
Pages (from-to)1314-1317
Number of pages4
JournalMicroelectronic Engineering
Volume85
Issue number5-6
DOIs
Publication statusPublished - May 2008

Keywords

  • Cantilever
  • Microcantilever
  • Polyimide
  • Surface stress sensor

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