Abstract
We present the fabrication of a polyimide microcantilever array with integrated gold piezoresistive strain gauges and a thick SU-8 backing for use as a surface stress sensor. The selected polyimide's low Young's modulus (1.8 GPa) theoretically results in a high sensitivity to changes in surface stress. Electroplated gold contact pads, 1.5 µm thick, provide a stable, repeatable surface onto which electrical connections to the fabricated device are made using spring-loaded microprobes. The piezoresistors are found to have a gauge factor of between 4 and 4.5 and a sensitivity to surface stress of 2.1 × 10-4 (N/m)-1. © 2008 Elsevier B.V. All rights reserved.
Original language | English |
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Pages (from-to) | 1314-1317 |
Number of pages | 4 |
Journal | Microelectronic Engineering |
Volume | 85 |
Issue number | 5-6 |
DOIs | |
Publication status | Published - May 2008 |
Keywords
- Cantilever
- Microcantilever
- Polyimide
- Surface stress sensor