Plastic-based Substrate Integrated Waveguide (SIW) components and antennas

Riccardo Moro, Maurizio Bozzi, Ana Collado, Apostolos Georgiadis, Selva Via

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the implementation of Substrate Integrated Waveguide (SIW) components and antennas in a polyethylene terephthalate (PET) substrate. PET is a cheap and flexible material, which represents an important candidate for the development of future conformal and wearable wireless systems.

The characterization of the electrical properties of the material has been performed by the measurement of integrated transmission lines. Passive components (including interconnects, coplanar waveguide-to-SIW transitions, and filters) as well as antennas in SIW technology have been designed and experimentally verified.

The achieved results represent the groundwork investigation on the applicability of SIW technology based on cost-effective and flexible materials. They open new perspective for the implementation of ultra low-cost components and systems for application in wireless sensor networks for the future Internet of Things.

Original languageEnglish
Title of host publication2012 7th European Microwave Integrated Circuits Conference (EuMIC)
PublisherIEEE
Pages627-630
Number of pages4
ISBN (Electronic)978-2-87487-026-2
ISBN (Print)978-1-4673-2302-4
Publication statusPublished - 2012
Event7th European Microwave Integrated Circuits Conference - Amsterdam, Netherlands
Duration: 29 Oct 201230 Oct 2012

Conference

Conference7th European Microwave Integrated Circuits Conference
Abbreviated titleEuMIC 2012
CountryNetherlands
CityAmsterdam
Period29/10/1230/10/12

Keywords

  • Novel materials
  • plastic substrates
  • substrate integrated waveguide (SIW)

Cite this

Moro, R., Bozzi, M., Collado, A., Georgiadis, A., & Via, S. (2012). Plastic-based Substrate Integrated Waveguide (SIW) components and antennas. In 2012 7th European Microwave Integrated Circuits Conference (EuMIC) (pp. 627-630). IEEE.