Picosecond laser machining of fiber based sensing devices

Engineering

• Consuming Process 50%
• Fused Silica 50%
• Interferometry 50%
• Manufacturing Cost 50%
• Mechanical Sensor 50%
• Outer Diameter 50%
• Picosecond Laser 100%
• Sensing Device 100%
• Silica Fibre 50%
• Single-Mode Optical Fiber 50%

INIS

• cost 33%
• devices 100%
• etching 16%
• fibers 100%
• interferometry 16%
• ion beams 16%
• laser beam machining 100%
• machining 33%
• manufacturing 50%
• modes (optical) 16%
• optical fibers 16%
• readout systems 16%
• sensors 50%
• silica 16%

Material Science

• Laser Beam Machining 100%
• Machining 66%
• Silicon Dioxide 33%
• Single-Mode Optical Fiber 33%