Optomechanical, electrical and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects

M H Ayliffe, D Kabal, P Khurana, F Lacroix, A G Kirk, Frank Alan Paul Tooley, D V Plant

Research output: Contribution to conferencePaper

Original languageEnglish
Pages502-505
Number of pages4
Publication statusPublished - 1998
EventOptics in Computing -
Duration: 1 Jan 1998 → …

Conference

ConferenceOptics in Computing
Period1/01/98 → …

Cite this

Ayliffe, M. H., Kabal, D., Khurana, P., Lacroix, F., Kirk, A. G., Tooley, F. A. P., & Plant, D. V. (1998). Optomechanical, electrical and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects. 502-505. Paper presented at Optics in Computing, .