Microultrasound is of increasing interest in medicine due to the real-time, high-resolution images that can be acquired. The resulting low penetration depth of the image requires the use of multiple transducers laid out as an array and their integration into space-constrained form factors such as needles or capsules to enable minimally invasive access to the site of interest. Miniaturisation of the transducers is possible with modern manufacturing technology but challenges exist in the creation of a reliable interconnection scheme able to produce a series of robust, independent electrical connections between the transducers and external electronics. This paper describes work done to characterise and optimise a low process temperature bonding technology with anisotropic conductive adhesive (ACA) for the production of miniature ultrasound systems with satisfactory yield.
|Name||IEEE International Ultrasonics Symposium|
|Conference||International Ultrasonics Symposium 2017|
|Period||6/09/17 → 9/09/17|