Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Gerard Cummins; Jun Gao; Rachael  McPhillips; David Watson; Sandy Cochran; Marc Phillipe Yves Desmulliez

doi:10.1109/ULTSYM.2017.8092114

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Gerard Cummins, Jun Gao, Rachael McPhillips, David Watson, Sandy Cochran, Marc Phillipe Yves Desmulliez

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

241 Downloads (Pure)

Abstract

Microultrasound is of increasing interest in medicine due to the real-time, high-resolution images that can be acquired. The resulting low penetration depth of the image requires the use of multiple transducers laid out as an array and their integration into space-constrained form factors such as needles or capsules to enable minimally invasive access to the site of interest. Miniaturisation of the transducers is possible with modern manufacturing technology but challenges exist in the creation of a reliable interconnection scheme able to produce a series of robust, independent electrical connections between the transducers and external electronics. This paper describes work done to characterise and optimise a low process temperature bonding technology with anisotropic conductive adhesive (ACA) for the production of miniature ultrasound systems with satisfactory yield.

Original language	English
Title of host publication	2017 IEEE International Ultrasonics Symposium (IUS)
Publisher	IEEE
ISBN (Electronic)	9781538633830
DOIs	https://doi.org/10.1109/ULTSYM.2017.8092114
Publication status	Published - 2 Nov 2017
Event	International Ultrasonics Symposium 2017 - Omni Shoreham Hotel, Washington D.C., United States Duration: 6 Sept 2017 → 9 Sept 2017

Publication series

Name	IEEE International Ultrasonics Symposium
Publisher	IEEE
ISSN (Electronic)	1948-5727

Conference

Conference	International Ultrasonics Symposium 2017
Country/Territory	United States
City	Washington D.C.
Period	6/09/17 → 9/09/17

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10.1109/ULTSYM.2017.8092114

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Cummins, G., Gao, J., McPhillips, R., Watson, D., Cochran, S., & Desmulliez, M. P. Y. (2017). Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive. In 2017 IEEE International Ultrasonics Symposium (IUS) Article 8092114 (IEEE International Ultrasonics Symposium). IEEE. https://doi.org/10.1109/ULTSYM.2017.8092114

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title = "Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive",

abstract = "Microultrasound is of increasing interest in medicine due to the real-time, high-resolution images that can be acquired. The resulting low penetration depth of the image requires the use of multiple transducers laid out as an array and their integration into space-constrained form factors such as needles or capsules to enable minimally invasive access to the site of interest. Miniaturisation of the transducers is possible with modern manufacturing technology but challenges exist in the creation of a reliable interconnection scheme able to produce a series of robust, independent electrical connections between the transducers and external electronics. This paper describes work done to characterise and optimise a low process temperature bonding technology with anisotropic conductive adhesive (ACA) for the production of miniature ultrasound systems with satisfactory yield.",

author = "Gerard Cummins and Jun Gao and Rachael McPhillips and David Watson and Sandy Cochran and Desmulliez, {Marc Phillipe Yves}",

year = "2017",

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Cummins, G, Gao, J, McPhillips, R, Watson, D, Cochran, S & Desmulliez, MPY 2017, Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive. in 2017 IEEE International Ultrasonics Symposium (IUS)., 8092114, IEEE International Ultrasonics Symposium, IEEE, International Ultrasonics Symposium 2017, Washington D.C., District of Columbia, United States, 6/09/17. https://doi.org/10.1109/ULTSYM.2017.8092114

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive. / Cummins, Gerard; Gao, Jun; McPhillips, Rachael et al.
2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 2017. 8092114 (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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AB - Microultrasound is of increasing interest in medicine due to the real-time, high-resolution images that can be acquired. The resulting low penetration depth of the image requires the use of multiple transducers laid out as an array and their integration into space-constrained form factors such as needles or capsules to enable minimally invasive access to the site of interest. Miniaturisation of the transducers is possible with modern manufacturing technology but challenges exist in the creation of a reliable interconnection scheme able to produce a series of robust, independent electrical connections between the transducers and external electronics. This paper describes work done to characterise and optimise a low process temperature bonding technology with anisotropic conductive adhesive (ACA) for the production of miniature ultrasound systems with satisfactory yield.

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Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

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