Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Gerard Cummins, Jun Gao, Rachael McPhillips, David Watson, Sandy Cochran, Marc Phillipe Yves Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Abstract

Microultrasound is of increasing interest in medicine due to the real-time, high-resolution images that can be acquired. The resulting low penetration depth of the image requires the use of multiple transducers laid out as an array and their integration into space-constrained form factors such as needles or capsules to enable minimally invasive access to the site of interest. Miniaturisation of the transducers is possible with modern manufacturing technology but challenges exist in the creation of a reliable interconnection scheme able to produce a series of robust, independent electrical connections between the transducers and external electronics. This paper describes work done to characterise and optimise a low process temperature bonding technology with anisotropic conductive adhesive (ACA) for the production of miniature ultrasound systems with satisfactory yield.
Original languageEnglish
Title of host publication2017 IEEE International Ultrasonics Symposium (IUS)
PublisherIEEE
ISBN (Electronic)9781538633830
DOIs
Publication statusPublished - 2 Nov 2017
EventInternational Ultrasonics Symposium 2017 - Omni Shoreham Hotel, Washington D.C., United States
Duration: 6 Sep 20179 Sep 2017

Publication series

NameIEEE International Ultrasonics Symposium
PublisherIEEE
ISSN (Electronic)1948-5727

Conference

ConferenceInternational Ultrasonics Symposium 2017
CountryUnited States
CityWashington D.C.
Period6/09/179/09/17

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    Cummins, G., Gao, J., McPhillips, R., Watson, D., Cochran, S., & Desmulliez, M. P. Y. (2017). Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive. In 2017 IEEE International Ultrasonics Symposium (IUS) [8092114] (IEEE International Ultrasonics Symposium). IEEE. https://doi.org/10.1109/ULTSYM.2017.8092114