Abstract
A novel method to manufacture two-dimensional bundles of single mode optical fibres at sub-micron pitch accuracy is presented. An array of holes, each surrounded by four electrodes has been produced using the UV-LIGA process. Electrostatic fields between the electrodes and a metal coated optical single mode fibre inserted into such a hole, are used to position the fibre. The position of the fibre core can be monitored and moved to its ideal position. Using thermal or UV activation a cement filling the hole around the fibre is cured to fix the fibre in place. ©2010 IEEE.
Original language | English |
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Title of host publication | 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10 |
Pages | 92-97 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2010 |
Event | 2010 International Symposium on Advanced Packaging Materials: Microtech - Cambridge, United Kingdom Duration: 28 Feb 2010 → 2 Mar 2010 |
Conference
Conference | 2010 International Symposium on Advanced Packaging Materials: Microtech |
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Abbreviated title | APM '10 |
Country/Territory | United Kingdom |
City | Cambridge |
Period | 28/02/10 → 2/03/10 |