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Open ended microwave oven for packaging
K. I. Sinclair
, T. Tilford
,
M. Y P Desmulliez
,
G. Goussetis
, C. Bailey
, K. Parrott
, A. J. Sangster
School of Engineering & Physical Sciences
Research output
:
Chapter in Book/Report/Conference proceeding
›
Conference contribution
6
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Citations (Scopus)
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INIS
devices
100%
packaging
100%
microwave ovens
100%
polymers
60%
cavities
60%
microwave radiation
60%
curing
60%
heating
40%
bonding
40%
alignment
40%
microelectronics
40%
physics
40%
levels
20%
risks
20%
applications
20%
distribution
20%
mapping
20%
solutions
20%
simulation
20%
feedback
20%
volume
20%
accuracy
20%
waveguides
20%
cameras
20%
manufacturing
20%
adhesives
20%
irradiation
20%
radiowave radiation
20%
ovens
20%
electromagnetic fields
20%
microwave heating
20%
thermal stresses
20%
temperature distribution
20%
cavity resonators
20%
Engineering
Microwave Curing
100%
Microelectronics
100%
Time Domain
50%
Closed Loop
50%
Finite Volume Method
50%
Underfill
50%
Open End
50%
Scale Level
50%
Optoelectronics
50%
Level Packaging
50%
Evanescent
50%
Solution Domain
50%
Thermal Stress
50%
Magnetic Field
50%
Radio Frequency
50%
Waveguide
50%
Resonator
50%
Temperature Distribution
50%
Microwave Heating
50%
Material Science
Waveguide
100%
Medical Device
100%
Thermal Stress
100%
Resonator
100%
Finite Difference Method
100%