Open-ended microwave oven for flip-chip assembly

INIS

• alignment 50%
• cavity resonators 100%
• cross sections 50%
• curing 50%
• devices 100%
• dielectrics 50%
• films 50%
• heat 50%
• heating 50%
• hot spots 50%
• levels 50%
• losses 50%
• microwave ovens 100%
• microwave radiation 50%
• ovens 100%
• packaging 50%
• permittivity 50%
• power 100%
• probes 50%
• surfaces 50%
• testing 50%
• waveguides 100%

Engineering

• Cross Section 50%
• Hot Spot 50%
• Level Packaging 50%
• Low Dielectric Loss 50%
• Microwave Curing 50%
• Open End 100%
• Relative Permittivity 50%
• Resonator 100%
• Scale Level 50%
• Underfill 50%
• Waveguide 100%
• X-Band 50%

Material Science

• Dielectric Material 50%
• Film 50%
• Permittivity 50%
• Resonator 100%
• Waveguide 100%